One Step Photolithography
Applications
Surfaces with three dimensional structures are required in several fields of micro technology. Structures with sawtooth profile (blaze) increase the efficiency of DOE. Tapered structures offer more flexibility in the design of microelectronic and micromechanical components. Examples of 3D shaping using HEBS gray level masks are:
- Tapered structures for microelectronics, e.g. tapered structures in thick polyimide to realize electrical connection between two metallic layers separated by the thick polyimide,
- Micro optical devices such as diffractive and refractive microlenses, bifocal intraocular lenses, widely asymmetric DOE, miniature compact disc heads, anti reflective surface, complex imaging optics, grating couples, polarization-sensitive beam splitters, spectral filters, wavelength division multiplexers, elements for head-up and helmet mounted display, for focal plane optical concentration and optical efficiency enhancement, for color separation, beam shaping, and for miniature optical scanners, microlens arrays, diffraction gratings, laser diode array collimators and correctors, aberration correction, hybrid optics.
- Integrated optical components, two dimensional fanout gratings, optical interconnect, signal switching, fiber pigtailing, DOE to couple light from a laser into a fiber,
- Micro-electro-mechanical (MEM) devices for sensors and actuators in automotive, machine tools, robotics and medical instrumentation, also devices for applications in micro valves, inertial microsensors, micromachined RF switches, GPS component miniaturization, and a host of other sensors and actuators for applications to space, air, land, and sea vehicles, as well as industrial, biotechnology and future consumer electronics,
- Micro-opto-electro-mechanical (MOEM) devices such as laser scanners, optical shutters, dynamic micro mirrors, optical choppers and optical switches.
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